Outlines:
Fundamentals of Particle Adhesion:
Van der Waals force, effect of particle deformation on adhesion, electrostatic
forces, electrical double layer phenomena, capillary condensation.
Hydrodynamic (Shear Stress) and Brush Cleaning
Hydrodynamic forces, laminar and turbulent flows, drag and lift forces,
boundary layer effects, effect of density and viscosity. Brush cleaning and the
effect of pressure, speed and time.
Megasonic and Ultrasonic Cleaning
Megasonic (frequency higher than 400 kHz) and ultrasonic (25-100 kHz)
cleaning has been utilized for many decades in many industries. Theory of
ultrasonics, cavitation, acoustic streaming, radiation force, substrate damage,
semiconductor wafer and post-CMP cleaning, cleaning of glass, metal and
other substrates is discussed.
Dry Ice Cleaning (Argon and CO2)
This relatively new surface cleaning technique bombards surface
contaminants with fine Argon or CO2 ice pellets. Both techniques advantages
and advantages will be discussed.
Laser Cleaning
This new surface cleaning technique can be used on a dry surface or a wet
substrate. In the dry process, the particles are removed using the laser and
then carried using a gas stream. In the wet process, the laser evaporate the
liquid film instantly and remove the contaminants. Both technique's
applications, advantages and advantages will be discussed.
* For on-site presentation, please contact us
Fundamentals of Particle Adhesion:
Van der Waals force, effect of particle deformation on adhesion, electrostatic
forces, electrical double layer phenomena, capillary condensation.
Hydrodynamic (Shear Stress) and Brush Cleaning
Hydrodynamic forces, laminar and turbulent flows, drag and lift forces,
boundary layer effects, effect of density and viscosity. Brush cleaning and the
effect of pressure, speed and time.
Megasonic and Ultrasonic Cleaning
Megasonic (frequency higher than 400 kHz) and ultrasonic (25-100 kHz)
cleaning has been utilized for many decades in many industries. Theory of
ultrasonics, cavitation, acoustic streaming, radiation force, substrate damage,
semiconductor wafer and post-CMP cleaning, cleaning of glass, metal and
other substrates is discussed.
Dry Ice Cleaning (Argon and CO2)
This relatively new surface cleaning technique bombards surface
contaminants with fine Argon or CO2 ice pellets. Both techniques advantages
and advantages will be discussed.
Laser Cleaning
This new surface cleaning technique can be used on a dry surface or a wet
substrate. In the dry process, the particles are removed using the laser and
then carried using a gas stream. In the wet process, the laser evaporate the
liquid film instantly and remove the contaminants. Both technique's
applications, advantages and advantages will be discussed.
* For on-site presentation, please contact us
| Surface cleaning |
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© 2010 Provectus Technologies, LLC. All rights reserved Terms of use I Privacy
© 2010 Provectus Technologies, LLC. All rights reserved Terms of use I Privacy
