The Pioneer 300
* Applications
1. Coating assessment of the HMDS process.
2. Wafer mapping Display for surface contamination detection.
3. Adhesive and primer preparation.
4. Coating uniformity & Coating quality.
1. Coating assessment of the HMDS process.
2. Wafer mapping Display for surface contamination detection.
3. Adhesive and primer preparation.
4. Coating uniformity & Coating quality.
* Technical Data
Pioneer 300 (Wafer Surface Analyzer)
The Pioneer 300 Wafer Surface Analysis System is specially designed for the use in 300 mm semiconductor wafer
processing for quality control. It provides quick and accurate contact angle/surface energy measurements of the
wafer surface to adhesion, cleanliness and surface treatments. The use of anti-static materials in the Pioneer 300
makes it well suited for semiconductor applications. The inner portions are specially designed to prevent particulate
formation or contamination and the system can be used to monitor the ultra clean surface processing of silicon
wafers. The position of the sample stage is computer-controlled and can be precisely adjusted along the x-,y-, or z-
axis. The user can easily control the position of the stage to allow for wafer surface mapping. The instrument uses
micro-pump controlled
by PC for precise and repeatable liquid drop formation and application. This insures that a reproducible drop
volume is applied to the surface.
The Pioneer 300 Wafer Surface Analysis System is specially designed for the use in 300 mm semiconductor wafer
processing for quality control. It provides quick and accurate contact angle/surface energy measurements of the
wafer surface to adhesion, cleanliness and surface treatments. The use of anti-static materials in the Pioneer 300
makes it well suited for semiconductor applications. The inner portions are specially designed to prevent particulate
formation or contamination and the system can be used to monitor the ultra clean surface processing of silicon
wafers. The position of the sample stage is computer-controlled and can be precisely adjusted along the x-,y-, or z-
axis. The user can easily control the position of the stage to allow for wafer surface mapping. The instrument uses
micro-pump controlled
by PC for precise and repeatable liquid drop formation and application. This insures that a reproducible drop
volume is applied to the surface.
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