The Phoenix 600
* Features
- Fully Automatic control for high precision and low errors.
- Automatic and rapid data analysis and high-speed dynamic image capture.
- Auto calculation of surface energy and work of adhesion
- High-resolution and powerful image capture system
- Automatic moving stage for sample positioning
- Available to modify various sample stages
- Installation of multiple syringe (max. 3) assembly
* Capabilities
- Static/ Dynamic Contact Angles
- Advancing and Receding contact angle by Captive method
- Surface Energy/ Surface Tension
- Sessile Drop/ Pendent Drop
- Sequence image captures by time basis
* Typical Application
- Semiconductor applications
- Evaluation of cleanliness/treatment/coating processing
- Detection of organic contamination on PCB and electronic components.
- Hydrophobicity and hydrophilicity of solid surfaces
- Quality control and R&D for 12” wafer and OLED
- Analysis of plasma treatments to increase the wettability on polymers surfaces.
* Options
- Thermal chamber (RT to 250)
- Thermal pad (RT to 250)
- Multi-Syringe dispensing system
- Tilt stage
- Large size stage for up to 300 x 400 mm
- Circular rotation stage for 12” wafer
- Fully Automatic control for high precision and low errors.
- Automatic and rapid data analysis and high-speed dynamic image capture.
- Auto calculation of surface energy and work of adhesion
- High-resolution and powerful image capture system
- Automatic moving stage for sample positioning
- Available to modify various sample stages
- Installation of multiple syringe (max. 3) assembly
* Capabilities
- Static/ Dynamic Contact Angles
- Advancing and Receding contact angle by Captive method
- Surface Energy/ Surface Tension
- Sessile Drop/ Pendent Drop
- Sequence image captures by time basis
* Typical Application
- Semiconductor applications
- Evaluation of cleanliness/treatment/coating processing
- Detection of organic contamination on PCB and electronic components.
- Hydrophobicity and hydrophilicity of solid surfaces
- Quality control and R&D for 12” wafer and OLED
- Analysis of plasma treatments to increase the wettability on polymers surfaces.
* Options
- Thermal chamber (RT to 250)
- Thermal pad (RT to 250)
- Multi-Syringe dispensing system
- Tilt stage
- Large size stage for up to 300 x 400 mm
- Circular rotation stage for 12” wafer
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* Technical Data