Consulting is available in the following areas:

Surface cleaning.
Particulate and ionic contamination.
Particle adhesion and removal on semiconductor, metallic and polymer substrates.
Microcontamination in CVD and PVD systems.
Physical modeling of contaminant transport and removal in CVD, PVD and wet  processes.
Process control and quality in CVD, PVD and electroplating processes
Megasonic cleaning.
Ultrasonic cleaning.
Contact (Brush) cleaning.
Post-CMP cleaning of W, Cu and Oxide films.
Airborne contamination in clean environments.
Physical modeling of airflow and particle transport and deposition in clean  environments.
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