POLI-500 model is unique and ideal for CMP process development and consumable function testing. It can
handle up to 200mm wafer as we as coupon. Automatic process and in-situ conditioning ensure consistent
polishing performance similar to a process realized with full production-line CMP system. It drastically reduces
the research-to-market time span.
* Specifications
- Head, table : Max 100 rpm, rotational motion, head oscillation (± 20mm)
- Size : 1200W 1000D 1700H
- Table size : Φ 500 mm
- Pressing method : Variable air pressure electronic controller 100~880 g/cm2 for 6” wafer, 60~500 g/cm2
for 8” wafer
- Process : Automatic sequence, Dry-in/Wet-out
- Conditioning : Ring type diamond conditioner
* Options
- Head/Table velocity upgrade : Max 200 rpm
- Stainless steel body
- Double head system : In process conditioning applicable
- Friction force monitoring system
* Applications
- Work piece: Max 8 inch wafer, MEMS structure, Coupon wafer
- CMP process: Si CMP, Oxide CMP(BPSG,TEOS,SC), Metal CMP(W, Cu), STI, PGI etc.
* Characteristics
- 200 mm CMP Machine for R&D
- Stable repeatability (WTWNU<5%)
- High rigidity, High Flatness
handle up to 200mm wafer as we as coupon. Automatic process and in-situ conditioning ensure consistent
polishing performance similar to a process realized with full production-line CMP system. It drastically reduces
the research-to-market time span.
* Specifications
- Head, table : Max 100 rpm, rotational motion, head oscillation (± 20mm)
- Size : 1200W 1000D 1700H
- Table size : Φ 500 mm
- Pressing method : Variable air pressure electronic controller 100~880 g/cm2 for 6” wafer, 60~500 g/cm2
for 8” wafer
- Process : Automatic sequence, Dry-in/Wet-out
- Conditioning : Ring type diamond conditioner
* Options
- Head/Table velocity upgrade : Max 200 rpm
- Stainless steel body
- Double head system : In process conditioning applicable
- Friction force monitoring system
* Applications
- Work piece: Max 8 inch wafer, MEMS structure, Coupon wafer
- CMP process: Si CMP, Oxide CMP(BPSG,TEOS,SC), Metal CMP(W, Cu), STI, PGI etc.
* Characteristics
- 200 mm CMP Machine for R&D
- Stable repeatability (WTWNU<5%)
- High rigidity, High Flatness
POLI-500
