POLI models are designed for research and development R&D and pilot production. These tools are stand
alone and provide high performance, flexibility, small footprint, easy to operate and low cost of ownership. POLI-
400 model is high reliability CMP tester. It drastically reduces process development duration which consequently
reduces the research-to-market time.
* Specifications
- Head, Table : Max 100 rpm, rotational motion, head oscillation (± 20mm)
- Size : 1000W 900D 1000H
- Table size : Φ 400 mm
- Pressing method : Variable air pressure electronic controller 60~700
g/cm2 for 4” wafer, 40~300 g/cm2 for 6” wafer
- Process : Automatic sequence, dry-in/wet-out
- Conditioning : Ring type diamond conditioner
* Options
- Head/Table velocity upgrade : Max 200 rpm
- Stainless steel body
- Double head system : In process conditioning applicable
- Friction force monitoring system
* Applications
- Work piece: Max 6 inch wafer, MEMS structure, coupon wafer
- CMP Process: Si CMP, Oxide CMP(BPSG,TEOS,SC), Metal CMP(W, Cu), STI, PGI etc.
* Characteristics
- Desk-top CMP Machine for R&D
- Stable repeatability (WTWNU<5%) - high rigidity, high Flatness - simple, robust and Low cost of ownership
alone and provide high performance, flexibility, small footprint, easy to operate and low cost of ownership. POLI-
400 model is high reliability CMP tester. It drastically reduces process development duration which consequently
reduces the research-to-market time.
* Specifications
- Head, Table : Max 100 rpm, rotational motion, head oscillation (± 20mm)
- Size : 1000W 900D 1000H
- Table size : Φ 400 mm
- Pressing method : Variable air pressure electronic controller 60~700
g/cm2 for 4” wafer, 40~300 g/cm2 for 6” wafer
- Process : Automatic sequence, dry-in/wet-out
- Conditioning : Ring type diamond conditioner
* Options
- Head/Table velocity upgrade : Max 200 rpm
- Stainless steel body
- Double head system : In process conditioning applicable
- Friction force monitoring system
* Applications
- Work piece: Max 6 inch wafer, MEMS structure, coupon wafer
- CMP Process: Si CMP, Oxide CMP(BPSG,TEOS,SC), Metal CMP(W, Cu), STI, PGI etc.
* Characteristics
- Desk-top CMP Machine for R&D
- Stable repeatability (WTWNU<5%) - high rigidity, high Flatness - simple, robust and Low cost of ownership
POLI-400
